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Software modelling feature matrix
Application Note AP627
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Product |
Tools for PCB stackup / controlled impedance / loss modelling |
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| Field Solver | Rigid Stackup | HDI builds | Hatched planes | Controlled impedance modelling (lossless – up to 2GHz) |
Insertion loss modelling (lossy – 3GHz and above) |
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| ✔ | ||||||
| ✔ | ✔ | |||||
| Speedstack / Field Solver bundle |
Rigid Stackup | HDI builds | Hatched planes | Controlled impedance modelling (lossless – up to 2GHz) |
Insertion loss modelling (lossy – 3GHz and above) |
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✔ |
✔ |
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✔ |
✔ |
✔ |
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✔ |
✔ |
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✔ |
✔ |
✔ |
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✔ |
✔ |
✔ |
✔ |
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✔ |
✔ |
✔ |
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✔ |
✔ |
✔ |
✔ |
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✔ |
✔ |
✔ |
✔ |
✔ |
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