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Featured product
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Featured product:
When designing and documenting stackups - it is vital the designer is aware of which layers are plated. Speedstack 21_03 higlights all the plated layers in a stack by selecting the apply plating colours icon. More detailed information?
This presentation covers the Speedstack 21_03 capabilities in detail. |
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Previously featured product (February 2021)
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Featured product:
A new shield material type, with full stackup editing and printing capability allows design and documentation of rigid and flex rigid PCBs with associated emc shield materials. Professional reports may be printed as shown above. More detailed information?
This presentation covers the shield capabilities in detail, if you prefer to see the changes in a video, this content is both available directly from this site or from the Polar YouTube channel. |
Previously Featured product (September 2020)
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Featured product:
Thin rigid and flex rigid constructions can sometimes require traces that are too narrow for good process yields. This can be resolved by referencing the signal trace to a non adjacent return plane. Discover how large the cutout in the intermediate plane needs to be with the 20.09 edition of these two popular impedance field solvers. New structures with cutout ground
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